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    ECSEL Project APPLAUSE Focuses on Low-Cost Manufacturing Packaging

    Article obtained from Photonics RSS Feed.

    A consortium of 31 European electronics packaging, optics, and photonics key players; equipment suppliers; and testing experts have launched a three-year project called “Advanced packaging for photonics, optics, and electronics for low-cost manufacturing in Europe” (APPLAUSE). The project aims to foster the European semiconductor value chain by building new tools, methods, and processes for high-volume manufacturing. The €34 million total budget is co-funded by the European Union’s Horizon 2020 research and innovation program as well as national funding agencies and industries (in Belgium, Germany, Netherlands, Finland, Austria, France, Hungary, Latvia, Norway, Switzerland, and Israel), as a part of the Electronics…

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    Oct, 30 2019 |

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